# How to Clean Tiny Chip Patterns Using a Special Chemical Developer > This patent describes a method for making advanced computer chips using extreme ultraviolet light and a special chemical developer that cleans away tiny metal leftover bits from the chip's patterns. - **Patent:** US 10866511 - **Original title:** Extreme ultraviolet photolithography method with developer composition - **Owner:** Taiwan Semiconductor Manufacturing Co TSMC - **Granted:** 2020 - **Status:** Active - **Times cited:** 5 - **Field:** semiconductors, consumer_electronics, manufacturing, materials ## What it does This method improves how tiny patterns are made on computer chips, especially for advanced manufacturing using extreme ultraviolet (EUV) light. It starts by putting a special light-sensitive material, called a photoresist, onto a silicon wafer, where this photoresist contains metal. After exposing this photoresist to light to create a pattern, the process uses a unique chemical liquid, called a first developer, to wash away the unexposed parts. This first developer (Claim 1) is mostly an organic solvent (at least 60% by weight) and includes a chemical additive, specifically a base, designed to remove any tiny metal residuals that might be left behind from the metal-containing photoresist. After this cleaning and patterning, the remaining photoresist acts like a stencil for etching the underlying material layer. ## What it does NOT cover - Does not cover lithography methods that use photoresists without a metal-containing chemical. - Does not cover developers where the organic solvent makes up less than 60% of the developer's total weight. - Does not cover developers that do not include a base as a chemical additive to remove metal residuals. - Does not cover processes where the etching of the material layer happens before the first developing step. - Does not cover a two-step developing process where the second developer also contains a chemical additive (Claim 7 specifies the second developer is 'free of additive'). ## The clever bit The innovation lies in precisely formulating the developer chemical. By combining a high percentage of organic solvent with a specific chemical additive (a base), the developer effectively cleans away tiny metal bits left over from the photoresist, which is critical for making extremely small and accurate patterns on chips. ## Real-world examples 1. Advanced semiconductor manufacturing processes 2. EUV (Extreme Ultraviolet) lithography for microchip fabrication 3. Manufacturing of high-performance CPUs and GPUs 4. Production of memory chips (DRAM, NAND flash) 5. Fabrication of logic chips for smartphones and data centers ## Why it matters This patent is crucial for making the smallest, most powerful computer chips. As chips get smaller, the manufacturing process becomes incredibly precise, and even tiny leftover materials can cause defects. By effectively removing metal residuals during the patterning process, this invention helps ensure that advanced chips, like those made by TSMC, can achieve their intended performance and reliability. ## Frequently asked questions ### What does How to Clean Tiny Chip Patterns Using a Special Chemical Developer cover? This patent describes a method for making advanced computer chips using extreme ultraviolet light and a special chemical developer that cleans away tiny metal leftover bits from the chip's patterns. ### Who owns patent US 10866511? Taiwan Semiconductor Manufacturing Co TSMC owns this patent, granted in 2020. ### When does this patent expire? This patent is expected to expire on June 8, 2037, when the invention enters the public domain. ### What is patent US 10866511 cited by? This patent has been cited by 5 later patents that build on its ideas. ### What problem does this patent solve? This patent is crucial for making the smallest, most powerful computer chips. As chips get smaller, the manufacturing process becomes incredibly precise, and even tiny leftover materials can cause defects. By effectively removing metal residuals during the patterning process, this invention helps ensure that advanced chips, like those made by TSMC, can achieve their intended performance and reliability. ### What does this patent NOT cover? Does not cover lithography methods that use photoresists without a metal-containing chemical. **Full plain-English explainer:** https://patentbrief.org/patent/us/10866511/extreme-ultraviolet-photolithography-method-with-developer-composition **Original patent:** https://patents.google.com/patent/US10866511 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How to Clean Metal Off Wafers After EUV Chipmaking](https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography) — This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips. - [Making Tiny Chip Patterns with Special Metal-Filled Ink](https://patentbrief.org/patent/us/10825684/material-composition-and-methods-thereof) — This patent describes a new light-sensitive material, called a resist, that uses special multi-metal complexes to create incredibly small patterns on computer chips using extreme ultraviolet light. - [Making Microchips with a Silicon-Containing Photoresist Layer](https://patentbrief.org/patent/us/10281819/silicon-containing-photoresist-for-lithography) — This patent describes a method for precisely creating tiny patterns on microchips using a special light-sensitive material, called a photoresist, that contains silicon and changes its properties when exposed to light. - [Making Tiny Chip Patterns Using Gas and Light](https://patentbrief.org/patent/us/10514610/lithography-patterning-with-a-gas-phase-resist) — This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips. - [How a Special Coating Stops Materials from Sticking](https://patentbrief.org/patent/us/12740286/nucleation-inhibiting-coating-containing-rare-earth-compounds-and-devices) — This patent describes a device with a special coating, made with rare earth elements, that prevents other materials from sticking to it, allowing for precise material placement on other surfaces.