# A Photonic Chip Package with Edge Fiber Connections > This patent describes a compact package for a photonic chip that integrates electrical components and short optical fibers, allowing direct connection to external optical cables from the side. - **Patent:** US 10598860 - **Original title:** Photonic die fan out package with edge fiber coupling interface and related methods - **Owner:** GlobalFoundries - **Granted:** 2020 - **Status:** Active - **Times cited:** 8 - **Field:** telecommunications, semiconductors ## What it does This patent describes a special package for a photonic integrated circuit (PIC), which is a chip that uses light. The package includes an `overmold body` that protects the main `PIC die` and other `ancillary devices` like amplifiers. Inside, short `optical fiber stubs` are connected to the PIC die's `optical waveguide system` (Claim 1). These stubs extend to the side of the package, forming an `edge fiber coupling interface` (Claim 1). This interface allows external optical fibers to connect using a `connector`, either by having the stubs `protrude` (Claim 2) or be `flush` (Claim 4) with the package's side. Electrical connections for the PIC die and ancillary devices are handled by a `redistribution wiring layer (RDL) interposer` and a `ball grid array (BGA)` for attaching to a circuit board (Claim 1). For example, this package could allow a high-speed data center switch to easily plug into fiber optic cables directly from the side of its chip module. ## What it does NOT cover - Does not cover packages where optical fibers connect from the top or bottom surfaces, only the 'lateral side' (Claim 1). - Does not cover packages without an 'overmold body' protecting the components (Claim 1). - Does not cover packages that lack both a 'redistribution wiring layer (RDL) interposer' and a 'ball grid array (BGA)' for electrical connections (Claim 1). - Does not cover packages where the optical fiber stubs are not 'operatively coupled to the optical waveguide system' of the PIC die (Claim 1). - Does not cover packages that do not include an 'ancillary device' alongside the PIC die (Claim 1). ## The clever bit The novelty lies in integrating the optical fiber stubs, the photonic chip, electrical ancillary devices, and electrical connections (RDL and BGA) into a single overmolded package with a specific `edge fiber coupling interface`. This design allows for direct, robust, and compact optical connections from the side of the package, simplifying manufacturing and system integration. ## Real-world examples 1. Optical transceivers for data centers 2. High-speed network interface cards 3. Fiber-optic communication modules 4. Photonic sensor packages ## Why it matters This packaging method is important for making photonic chips more practical and easier to integrate into electronic systems. By combining optical and electrical components in one compact package with a standardized edge connection, it simplifies assembly and improves reliability for high-speed data transfer. This approach helps reduce the physical size and cost of optical transceivers, which are critical for modern data centers and telecommunications networks. ## Frequently asked questions ### What does A Photonic Chip Package with Edge Fiber Connections cover? This patent describes a compact package for a photonic chip that integrates electrical components and short optical fibers, allowing direct connection to external optical cables from the side. ### Who owns patent US 10598860? GlobalFoundries owns this patent, granted in 2020. ### When does this patent expire? This patent is expected to expire on March 14, 2038, when the invention enters the public domain. ### What is patent US 10598860 cited by? This patent has been cited by 8 later patents that build on its ideas. ### What problem does this patent solve? This packaging method is important for making photonic chips more practical and easier to integrate into electronic systems. By combining optical and electrical components in one compact package with a standardized edge connection, it simplifies assembly and improves reliability for high-speed data transfer. This approach helps reduce the physical size and cost of optical transceivers, which are critical for modern data centers and telecommunications networks. ### What does this patent NOT cover? Does not cover packages where optical fibers connect from the top or bottom surfaces, only the 'lateral side' (Claim 1). **Full plain-English explainer:** https://patentbrief.org/patent/us/10598860/photonic-die-fan-out-package-with-edge-fiber-coupling-interface-and-related-meth **Original patent:** https://patents.google.com/patent/US10598860 --- _Source: PatentBrief — https://patentbrief.org. Patent facts are from public records; the plain-English explanation is PatentBrief's._ ## Related patents Semantically similar inventions in the PatentBrief corpus: - [How to Precisely Connect Light Chips to Optical Fibers](https://patentbrief.org/patent/us/11150423/optical-and-thermal-interface-for-photonic-integrated-circuits) — This patent describes a clever way to accurately align tiny light-emitting components inside a photonic chip with an external optical connector, using a built-in alignment mark and a viewing hole. - [How Chips Get Both Light and Electricity on a Special Glass Base](https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho) — This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. - [How Chips Talk Fast with Light Inside a Circuit Board](https://patentbrief.org/patent/us/20260003141/package-having-component-carrier-and-embedded-optical-and-electric-chips-with-ho) — This patent describes a way to embed light-based (optical) and electricity-based (electric) computer chips directly next to each other within a circuit board, allowing them to communicate very quickly along a flat, horizontal path. - [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication. - [Flexible Silicon Chips That Send Data Using Light](https://patentbrief.org/patent/us/20130230274/photonic-flexible-interconnect) — This patent describes a flexible silicon chip that uses light to send data between different parts of a computer, making connections faster and potentially more compact.