# Rajesh Katkar — Patents explained on PatentBrief

Rajesh Katkar has 1 landmark patent explained in plain English on PatentBrief.

- [How a Fan-Out Chip Package Connects Multiple Chips on a Metal Substrate](https://patentbrief.org/patent/us/10181457/microelectronic-package-for-wafer-level-chip-scale-packaging-with-fan-out) — granted 2019
  This patent describes a way to stack and connect multiple tiny computer chips using a metal base, allowing more connections to spread out from the chip.

**Full profile:** https://patentbrief.org/inventor/rajesh-katkar

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._