# Joy Cheng — Patents explained on PatentBrief

Joy Cheng has 1 landmark patent explained in plain English on PatentBrief.

- [How to Clean Metal Off Wafers After EUV Chipmaking](https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography)
  This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips.

**Full profile:** https://patentbrief.org/inventor/joy-cheng

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._