# Chien-Te Wu — Patents explained on PatentBrief

Chien-Te Wu has 1 landmark patent explained in plain English on PatentBrief.

- [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — granted 2024
  TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication.

**Full profile:** https://patentbrief.org/inventor/chien-te-wu

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._