# Chen-Hua Yu — Patents explained on PatentBrief

Chen-Hua Yu has 1 landmark patent explained in plain English on PatentBrief.

- [How to Stack Two Computer Chips with Direct Connections](https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package) — granted 2016
  TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.

**Full profile:** https://patentbrief.org/inventor/chen-hua-yu

---

_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._