# Arvind Chandrasekaran — Patents explained on PatentBrief

Arvind Chandrasekaran has 1 landmark patent explained in plain English on PatentBrief.

- [Connecting Computer Chips with a Special Bridge Die](https://patentbrief.org/patent/us/7969009/through-silicon-via-bridge-interconnect) — granted 2011
  This patent describes a system for connecting multiple computer chips side-by-side using a third, 'bridge' chip that has vertical tunnels (TSVs) to link them together.

**Full profile:** https://patentbrief.org/inventor/arvind-chandrasekaran

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._