Skip to content
PatentBrief

Multi-patent compare

Up to four patents, side by side.

Compare citations, claim scope, expiry, litigation, an estimated value range, and an A–F strength grade across multiple patents in one view. Use it for portfolio analysis, competitor research, or FTO scoping.

Patent numbers

One per slot. Format: us/7657849 or just 7657849.

US 9412678

How to Stack Two Computer Chips with Direct ConnectionsTaiwan Semiconductor Manufacturing Co TSMC

US 12181722

Stacking Chips with Light-Guiding Plastic WiresTaiwan Semiconductor Manufacturing Co TSMC

US 10514610

Making Tiny Chip Patterns Using Gas and LightTaiwan Semiconductor Manufacturing Co TSMC

US 20250172879

How to Clean Metal Off Wafers After EUV ChipmakingTaiwan Semiconductor Manufacturing Co TSMC
Statusactiveactiveactiveactive
Filing date2015-03-202023-08-092018-07-092025-01-17
Grant date2016-08-092024-12-312019-12-24
Expires2035-03-202043-08-092038-07-092045-01-17
Claims23232323
Forward citations1000
Backward citations615390
LitigationNoneNoneNoneNone
Estimated value$59K – $187K$35K – $112K$37K – $117K$29K – $94K
Strength gradeD (52/100)D (47/100)D (47/100)F (43/100)

For spreadsheet portfolio analysis.

Estimated value uses the same heuristic as the Patent Value Estimator. Heuristic only — not a substitute for professional appraisal.