# Taiwan Semiconductor Manufacturing Co TSMC — Patents explained on PatentBrief

Taiwan Semiconductor Manufacturing Co TSMC has 4 landmark patents explained in plain English on PatentBrief.

- [How to Clean Metal Off Wafers After EUV Chipmaking](https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography)
  This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips.
- [Stacking Chips with Light-Guiding Plastic Wires](https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using) — granted 2024
  TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication.
- [Making Tiny Chip Patterns Using Gas and Light](https://patentbrief.org/patent/us/10514610/lithography-patterning-with-a-gas-phase-resist) — granted 2019
  This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips.
- [How to Stack Two Computer Chips with Direct Connections](https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package) — granted 2016
  TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom.

**Full profile:** https://patentbrief.org/company/taiwan-semiconductor-manufacturing-co-tsmc

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._