https://patentbrief.org/company/taiwan-semiconductor-manufacturing-co-tsmc Plain-English explanations of patents assigned to Taiwan Semiconductor Manufacturing Co TSMC, newest first. en-us Wed, 29 Jul 2026 01:01:29 GMT https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography This patent describes a specialized system and cleaning fluid used to precisely remove tiny metal bits from silicon wafers after they've been patterned using extreme ultraviolet light for making advanced computer chips. Thu, 23 Jul 2026 10:57:14 GMT https://patentbrief.org/patent/us/20250172879/metal-compound-removing-solvent-and-method-in-lithography https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using TSMC's patent describes a method for building advanced chip packages that combine electrical and light-based circuits using polymer waveguides and an integrated fan-out redistribution layer for faster communication. Tue, 31 Dec 2024 00:00:00 GMT https://patentbrief.org/patent/us/12181722/structures-and-process-flow-for-integrated-photonic-electric-ic-package-by-using https://patentbrief.org/patent/us/10514610/lithography-patterning-with-a-gas-phase-resist This patent describes an advanced machine that uses a special gas and patterned light, like a tiny stencil, to draw incredibly small features directly onto a silicon wafer for making computer chips. Tue, 24 Dec 2019 00:00:00 GMT https://patentbrief.org/patent/us/10514610/lithography-patterning-with-a-gas-phase-resist https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package TSMC's patent describes a compact way to stack two computer chips directly on top of each other, using a special filling material to hold tiny electrical connections in place, often with the top chip being wider than the bottom. Tue, 09 Aug 2016 00:00:00 GMT https://patentbrief.org/patent/us/9412678/structure-and-method-for-3d-ic-package