# Samsung Electronics Co — Patents explained on PatentBrief

Samsung Electronics Co has 5 landmark patents explained in plain English on PatentBrief.

- [How Devices Use 'Credits' to Manage Data Flow to Storage](https://patentbrief.org/patent/us/11593031/operating-method-of-host-device-and-storage-device-using-credit) — granted 2023
  This patent describes a system where a main device and a storage device use a 'credit' system to efficiently manage the flow of commands and responses, preventing either side from being overwhelmed with too much data.
- [How AI Connects Different Databases Using Knowledge Graphs](https://patentbrief.org/patent/us/11507851/system-and-method-of-integrating-databases-based-on-knowledge-graph) — granted 2022
  This patent describes a server-based method that uses artificial intelligence and two learning models to automatically find and integrate connections between data fields and data values across multiple databases that have different structures.
- [Fixing Blurry Tomography Scans from Patient Movement](https://patentbrief.org/patent/us/10307129/apparatus-and-method-for-reconstructing-tomography-images-using-motion-informati) — granted 2019
  This patent describes a method for creating clearer 3D medical scans by using two different X-ray scans to detect and correct for patient movement during the imaging process.
- [How NAND Flash Memory Adjusts to Cold Temperatures](https://patentbrief.org/patent/us/10019188/storage-devices-memory-systems-and-operating-methods-to-suppress-operating-error) — granted 2018
  This patent describes a method for NAND flash memory systems to prevent errors by automatically adjusting their operating conditions, like data speed or voltage, when the temperature drops too low.
- [How to Stack Computer Chips on a Wafer for Smaller Devices](https://patentbrief.org/patent/us/7824959/wafer-level-stack-structure-for-system-in-package-and-method-thereof) — granted 2010
  This patent describes a method for stacking two full wafers of computer chips, where the chips on each wafer are roughly the same overall size but have different active areas, to create a compact system-in-package.

**Full profile:** https://patentbrief.org/company/samsung-electronics-co

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._