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    <title>Rohm Co Ltd — New Patents | PatentBrief</title>
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    <description>Plain-English explanations of patents assigned to Rohm Co Ltd, newest first.</description>
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    <lastBuildDate>Mon, 15 Jun 2026 05:59:45 GMT</lastBuildDate>
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      <title>How Rohm Designs Compact Semiconductor Packages for Better Heat Management</title>
      <link>https://patentbrief.org/patent/us/RE49912/rotomolded-cooler</link>
      <description>A semiconductor packaging design by Rohm that arranges multiple chips and specific lead terminals to optimize space and thermal performance in electronic devices.</description>
      <pubDate>Tue, 09 Apr 2024 00:00:00 GMT</pubDate>
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