# MediaTek — Patents explained on PatentBrief

MediaTek has 1 landmark patent explained in plain English on PatentBrief.

- [How Chips Are Stacked and Wired in Tiny Phone Parts](https://patentbrief.org/patent/us/8310051/package-on-package-with-fan-out-wlcsp) — granted 2012
  MediaTek's 2012 patent describes a way to stack different types of computer chips, like a processor and memory, very closely together in a single package using special wiring that spreads out connections, saving space in devices like smartphones.

**Full profile:** https://patentbrief.org/company/mediatek

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_Source: PatentBrief — https://patentbrief.org. Plain-English explanations of US patents._