https://patentbrief.org/company/mediatek Plain-English explanations of patents assigned to MediaTek, newest first. en-us Wed, 29 Jul 2026 00:56:17 GMT https://patentbrief.org/patent/us/8310051/package-on-package-with-fan-out-wlcsp MediaTek's 2012 patent describes a way to stack different types of computer chips, like a processor and memory, very closely together in a single package using special wiring that spreads out connections, saving space in devices like smartphones. Tue, 13 Nov 2012 00:00:00 GMT https://patentbrief.org/patent/us/8310051/package-on-package-with-fan-out-wlcsp