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      <title>Combining Sealed and Exposed Sensors on One Microchip</title>
      <link>https://patentbrief.org/patent/us/8387464/laterally-integrated-mems-sensor-device-with-multi-stimulus-sensing</link>
      <description>This patent describes a microchip design that integrates multiple tiny sensors on the same side, where one sensor is exposed to the outside world through a backside hole while others remain protected by a sealed cap.</description>
      <pubDate>Tue, 05 Mar 2013 00:00:00 GMT</pubDate>
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