https://patentbrief.org/company/corning Plain-English explanations of patents assigned to Corning, newest first. en-us Wed, 29 Jul 2026 00:56:18 GMT https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho This patent describes a way to build computer chip packages using a special glass base that can carry both electrical signals and light signals, making chips faster and more efficient. Tue, 10 Jun 2025 00:00:00 GMT https://patentbrief.org/patent/us/12326604/integrated-circuit-packages-having-electrical-and-optical-connectivity-and-metho